High-Density Substrate Mounting - Assembly and Inspection
We respond flexibly to the quality demanded by our customers and the changing delivery requirements, achieving a 100% compliance rate for requested delivery dates.
Our strength lies in our integrated production system, which encompasses everything from the assembly of fine chips (0603) to large QFP, BGA, and CSP, as well as board assembly and unit assembly. Additionally, we have inline automated optical inspection equipment to work on stabilizing and improving assembly quality. SMT assembly: 3 lines with a monthly capacity of 40 million shots (24-hour operation). We can flexibly accommodate everything from prototypes to mass production. We can also propose cost reduction and quality improvement suggestions.
- Company：小橋電機 磯部工場
- Price：Other
